Structure for attaching a semiconductor wafer section to a suppo

Details Structure for attaching a semiconductor wafer section to a suppo Structure for attaching a semiconductor wafer section to a suppo

1997-08-11

1999-08-31

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257668, 257683, 257730, H01L 23495, H01L 2316, H01L 2304

Patent

active

059457333

ABSTRACT:
A method for attaching a semiconductor wafer section to a lead frame comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.

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