Structure and method to gain substantial reliability...

Details Structure and method to gain substantial reliability... Structure and method to gain substantial reliability...

2011-01-25

2011-01-25

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S843000, C257S737000

Reexamination Certificate

active

07875806

ABSTRACT:
Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solders are heated to a temperature above a melting point of the Pb-free solder joint for a sufficient time to allow complete melting of both the Pb-free solder joints and Pb-containing solder paste and the homogenous mixing thereof during assembly. These molten materials mix together such that the Pb from the Pb-containing solder disperses throughout substantially the entire Pb-free solder joint for complete homogenization of the molten materials to form the homogenous hybrid interconnect structures of the invention.

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Solder Joint Formation With Sn-Ag-Cu and Sn-Pb Solder BAI Pastes, Polina Snugovsky et al., Clestica International, Inc.; SMTA, Dec. 31, 2003; www.smta.org/knowledge/proceedings—abstract.cfm?PROCEEDING—ID+1128.

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