Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-09-23
1995-02-14
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156662, 1566591, 1566611, 437225, 437228, H01L 2100
Patent
active
053891988
ABSTRACT:
A method of manufacturing structures such as a pressure gauge, an accelerometer and the like with a single crystal material such as silicon uses etching techniques where the shape of a part subjected to stress concentration has a curvature, another part is formed in a plane body and a polyhedron is constituted by combining both.
To attain the above constitution, a wafer of single crystal material is formed with a stepped surface having a value corresponding to at least the depth of the curvature in a first anisotropic etching process using a prescribed etching mask, and in a second anisotropic etching process, an etching mask is used by removing at least a part of the etching mask used in the first anisotropic etching process.
REFERENCES:
patent: 4911783 (1990-03-01), Voboril
patent: 5116457 (1992-05-01), Jerman
patent: 5131978 (1992-07-01), O'Neil
Hayashi Masahide
Ichikawa Norio
Koide Akira
Obayashi Hidehito
Sato Kazuo
Dang Thi
Hitachi , Ltd.
Hitachi Automotive Engineering Co. Ltd.
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