Structure and method for providing a lead frame with enhanced so

Details Structure and method for providing a lead frame with enhanced so Structure and method for providing a lead frame with enhanced so

1995-05-04

1996-07-02

Utech, Benjamin

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

427 96, 427340, 427355, B44C 122

Patent

active

055318606

ABSTRACT:
A lead frame for used in a surface mount package is provided leads which are each notched at the tip of the lead to reduce the exposed area of based metal and to increase the area on which solder wetting can take place when bonded to conductive traces of a printed circuit board. In one embodiment, the thickness of the tip of the lead is reduced to further the area over which soldering wetting takes place. In that embodiment, the exposed base metal area is reduced by 85 per cent.

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patent: 4232281 (1980-11-01), Smith
patent: 4722060 (1988-01-01), Quinn et al.
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 5017164 (1991-05-01), Gibbs
patent: 5088930 (1992-02-01), Murphy

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