Structure and method for forming a multilayered structure

Details Structure and method for forming a multilayered structure Structure and method for forming a multilayered structure

2005-03-22

2005-03-22

Walke, Amanda (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S311000, C430S314000, C430S316000, C430S317000, C430S322000, C430S324000, C430S330000, C430S394000, C428S106000, C428S119000

Reexamination Certificate

active

06869750

ABSTRACT:
Improved methods for forming multilayer circuit structures are disclosed. In some embodiments, conductive layers, dielectric layers and conductive posts can be formed on both sides of a circuitized core structure. The conductive posts are disposed in the dielectric layers and can be stacked to form a generally vertical conduction pathway which passes at least partially through a multilayer circuit structure. The formed multilayer circuit structures can occupy less space than corresponding multilayer circuit structures with stacked via structures.

REFERENCES:
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3976524 (1976-08-01), Feng
patent: 4181755 (1980-01-01), Liu et al.
patent: 4614021 (1986-09-01), Hulseweh
patent: 4824802 (1989-04-01), Brown et al.
patent: 4908940 (1990-03-01), Amano et al.
patent: 4915983 (1990-04-01), Lake et al.
patent: 4921777 (1990-05-01), Fraenkel et al.
patent: 4980034 (1990-12-01), Volfson et al.
patent: 5063175 (1991-11-01), Broadbent
patent: 5071518 (1991-12-01), Pan
patent: 5091289 (1992-02-01), Cronin et al.
patent: 5097393 (1992-03-01), Nelson et al.
patent: 5106461 (1992-04-01), Volfson et al.
patent: 5118385 (1992-06-01), Kumar
patent: 5137597 (1992-08-01), Curry, II et al.
patent: 5162260 (1992-11-01), Leibovitz
patent: 5188702 (1993-02-01), Takayama et al.
patent: 5283081 (1994-02-01), Kata et al.
patent: 5287619 (1994-02-01), Smith et al.
patent: 5316974 (1994-05-01), Crank
patent: 5337466 (1994-08-01), Ishida
patent: 5454928 (1995-10-01), Rogers et al.
patent: 5464653 (1995-11-01), Chantraine et al.
patent: 5495665 (1996-03-01), Carpenter et al.
patent: 5512514 (1996-04-01), Lee
patent: 5529504 (1996-06-01), Greenstein et al.
patent: 5654237 (1997-08-01), Suguro et al.
patent: 5699613 (1997-12-01), Chong et al.
patent: 5707893 (1998-01-01), Bhatt et al.
patent: 5763324 (1998-06-01), Nogami
patent: 5784782 (1998-07-01), Boyko et al.
patent: 5817574 (1998-10-01), Gardner
patent: 5819406 (1998-10-01), Yoshizawa et al.
patent: 5830533 (1998-11-01), Lin et al.
patent: 5834845 (1998-11-01), Stolmeijer
patent: 5843839 (1998-12-01), Ng
patent: 5851910 (1998-12-01), Hsu et al.
patent: 5879568 (1999-03-01), Urasaki et al.
patent: 5891606 (1999-04-01), Brown
patent: 5891799 (1999-04-01), Tsui
patent: 5916453 (1999-06-01), Beilin et al.
patent: 5925206 (1999-07-01), Boyko et al.
patent: 5939789 (1999-08-01), Kawai et al.
patent: 5998291 (1999-12-01), Bakhit et al.
patent: 6013417 (2000-01-01), Sebesta et al.
patent: 6071814 (2000-06-01), Jang
patent: 6451509 (2002-09-01), Keesler et al.
patent: 6462107 (2002-10-01), Sinclair et al.
patent: 6541712 (2003-04-01), Gately et al.
patent: 6594891 (2003-07-01), Kamperman et al.
patent: 6627824 (2003-09-01), Lin
patent: 6638690 (2003-10-01), Meier et al.
patent: 56-116697 (1981-09-01), None
patent: 63-244796 (1988-10-01), None
Pan et al., “A Planar Approach to High Density Copper-Polymide Interconnect Fabrication,” pp. 174-189, Proceeding of the Technical Conference—8thInt'l Electronics Packaging Conference (1988).
Iwasaki et al., “A Pillar-Shaped Via Structure in a Cu-Polymide Multilayer Substrate,” pp. 127-131, Proceedings of the 1989 Japan International Electronic Manufacturing Technology Symposium.

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