Structurally reinforced ball grid array semiconductor package an

Details Structurally reinforced ball grid array semiconductor package an Structurally reinforced ball grid array semiconductor package an

1996-11-19

1998-08-18

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257738, 257778, 257779, H01L 2348, H01L 2352, H01L 2940

Patent

active

057961697

ABSTRACT:
Supporting structure for a ball grid array surface mounted integrated circuit device composed of support solder formed at selective corner locations on the ball grid array surface of the integrated circuit device. In one form, L-shaped patterns of high melting temperature solder are formed along the axes defined by the ball grid array and are characterized in that cross sections of the L-shaped pattern match that of the solder balls along one axis, and represent a continuum of solder between solder ball locations along the other axis. Support solder can be added where necessary to provide both structural reinforcement and thermal conduction. Control of the cross section of the support solder ensures that surface tension effects of the molten low temperature reflow solder used to connect the integrated circuit device does not materially change the final relative spacing between the integrated circuit device balls and the underlying printed circuit board contacts.

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