Structural element and process for its production including...

Details Structural element and process for its production including... Structural element and process for its production including...

2005-07-12

2005-07-12

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S761000, C438S765000, C438S771000

Reexamination Certificate

active

06916739

ABSTRACT:
A method for manufacturing structural elements provides a first part with a surface that is substantially copper and a second part with a surface of a metal. The surface of the first part is coated with a hard layer which is stable at a temperature of at least 80° C. and which, at this temperature, forms an oxygen diffusion barrier when exposed to ambient. The layer has a barrier effect similar to that of an aluminum oxide layer formed in a standard environment on aluminum. The surfaces are connected to each other by bonding with heating to at least 80° C.

REFERENCES:
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patent: 5820980 (1998-10-01), Asakawa et al.
patent: 6033482 (2000-03-01), Parkhe
patent: 6335569 (2002-01-01), Joshi
patent: 2002/0009621 (2002-01-01), Finely et al.
patent: 2002/0127845 (2002-09-01), Farrar

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