Structural design for flip-chip assembly

Details Structural design for flip-chip assembly Structural design for flip-chip assembly

2006-11-21

2006-11-21

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S127000

Reexamination Certificate

active

07138300

ABSTRACT:
An integrated circuit package comprises a semiconductor die located on a substrate in a flip-chip configuration, an encapsulant layer overlying the non-active surface of the semiconductor die and at least a portion of the surface of the substrate adjacent the die, and a heat spreader comprising a thermally conductive material. The heat spreader directly interfaces to a top surface of the encapsulant layer overlying the die and the substrate. This package provides physical protection during handling and reduced die stress and warpage.

REFERENCES:
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4583283 (1986-04-01), Dubois et al.
patent: 4914551 (1990-04-01), Anschel
patent: 5057909 (1991-10-01), Mok et al.
patent: 5151388 (1992-09-01), Bakhit et al.
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5459352 (1995-10-01), Layton et al.
patent: 5497027 (1996-03-01), Crafts
patent: 5504652 (1996-04-01), Foster et al.
patent: 5521406 (1996-05-01), Tserng et al.
patent: 5579249 (1996-11-01), Edwards
patent: 5610442 (1997-03-01), Schneider et al.
patent: 5621615 (1997-04-01), Dawson et al.
patent: 5650918 (1997-07-01), Suzuki
patent: 5723369 (1998-03-01), Barber
patent: 5736785 (1998-04-01), Chiang et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5744869 (1998-04-01), Root
patent: 5757081 (1998-05-01), Chang et al.
patent: 5767578 (1998-06-01), Chang et al.
patent: 5785799 (1998-07-01), Culnane et al.
patent: 5789810 (1998-08-01), Gross et al.
patent: 5801072 (1998-09-01), Barber
patent: 5883430 (1999-03-01), Johnson
patent: 5903436 (1999-05-01), Brownell et al.
patent: 5986885 (1999-11-01), Wyland
patent: 6187601 (2001-02-01), Hu et al.
patent: 6285078 (2001-09-01), Nelson
patent: 6410988 (2002-06-01), Caletka et al.
patent: 6411507 (2002-06-01), Akram
patent: 6459144 (2002-10-01), Pu et al.
patent: 6507116 (2003-01-01), Caletka et al.
patent: 6512295 (2003-01-01), Gaynes et al.
patent: 6661103 (2003-12-01), Akram
patent: 6681482 (2004-01-01), Lischner et al.
patent: 6720650 (2004-04-01), Miyazaki
patent: 6750552 (2004-06-01), Narayanan
patent: 2-28351 (1990-01-01), None
patent: 05235098 (1993-10-01), None
patent: 5-291421 (1993-11-01), None
patent: 08078584 (1996-03-01), None
patent: 9326418 (1997-12-01), None
patent: 10032305 (1998-02-01), None
patent: 529112 (2003-04-01), None
“Technical Forum-Chip-Scale Packages for Center-Pad Memory Devices (Con't)”, May 1998, pp. 1-7 at http://www.chipscalereview.com/issues/0598/amagaiA2.htm Jun. 2, 2004.
“Aluminum Nitride Cap Design Obviating Problems Of Thermal Conductivity And TEC Associated With Polymer-Ceramic Substrate”, IBM Technical Disclosure Bulletin, vol. 34, No. 78, Dec. 1991, pp. 341-342.

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