Stress release mechanism in MEMS device and method of making...

Details Stress release mechanism in MEMS device and method of making... Stress release mechanism in MEMS device and method of making...

2007-09-11

2007-09-11

Tamai, Karl (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Charge accumulating

C073S514320, C073S504120

Reexamination Certificate

active

11192874

ABSTRACT:
MEMS devices (100) and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device (100) comprises a substrate (106) having a surface, an electrode (128) having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism (204) disposed on the electrode second portion, the stress-release mechanism (204) including a first slot (208) integrally formed in the electrode. In another exemplary embodiment, the substrate (106) includes an anchor (134, 136) and the stress-release mechanism222is formed adjacent the anchor (134, 136).

REFERENCES:
patent: 5350189 (1994-09-01), Tsuchitani et al.
patent: 6445106 (2002-09-01), Ma et al.
patent: 6494096 (2002-12-01), Sakai et al.
patent: 6771001 (2004-08-01), Mao et al.
patent: 6798113 (2004-09-01), Ives
patent: 7126249 (2006-10-01), Shimanouchi
patent: 2004/0231421 (2004-11-01), Yoshioka et al.
patent: 2005/0019974 (2005-01-01), Lutz et al.
patent: 2005/0185310 (2005-08-01), Kurosawa
patent: 2007/0024156 (2007-02-01), Li et al.
patent: 2004347475 (2004-12-01), None

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