Stress reduction package and process

Details Stress reduction package and process Stress reduction package and process

1989-01-10

1991-09-17

Laroche, Eugene R.

357 74, H01L 2348

Patent

active

050499769

ABSTRACT:
An integrated circuit package (10) has a layer (22) of silicon positioned between copper die attach pad (18) and silicon integrated circuit die (12). The layer (22) should have a thickness of about half that of the silicon die (12). The layer (22) should also extend symmetrically beyond the die (12). Such an extension provides a horizontal surface beyond the die (12) to which thermosetting encapsulating resin (20) will adhere to produce an enhanced stress reduction effect. Vertical edges (23) of the layer (22) also help to prevent stress of the die (12) by resisting force from the encapsulating resin (20) after it shrinks during curing.

REFERENCES:
patent: 3284176 (1966-11-01), Reed et al.
patent: 3588632 (1971-07-01), Nakata
patent: 3609471 (1971-09-01), Scace et al.
patent: 3646409 (1972-02-01), Van de Water et al.
patent: 3718107 (1973-02-01), Bartels
patent: 3733525 (1973-05-01), Robinson et al.
patent: 3740619 (1973-06-01), Rosvold
patent: 3823772 (1974-07-01), Lavering
patent: 3896479 (1975-07-01), Di Lorenzo
patent: 4204628 (1980-05-01), Houston
patent: 4211354 (1980-07-01), Hoffman et al.
patent: 4257156 (1981-03-01), Houston
patent: 4281941 (1981-08-01), Rottenkolber
patent: 4315591 (1982-02-01), Houston
patent: 4320412 (1982-03-01), Hynes et al.
patent: 4427993 (1984-01-01), Fichot et al.
patent: 4445271 (1984-05-01), Grabbe
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4572757 (1986-02-01), Spadafora
patent: 4656499 (1987-04-01), Butt

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