Stress-distribution detecting semiconductor package group...

Details Stress-distribution detecting semiconductor package group... Stress-distribution detecting semiconductor package group...

2011-05-03

2011-05-03

Noori, Max (Department: 2855)

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

Specified electrical sensor or system

C073S760000

Reexamination Certificate

active

07934429

ABSTRACT:
A stress-distribution detecting semiconductor package group includes multiple stress-distribution detecting semiconductor packages each formed by resin-encapsulating a stress detecting semiconductor chip of the same size using an identical resin encapsulation structure. Each stress detecting semiconductor chip includes a piezoelectric element for stress detection and at least two electrode pads electrically connected to the piezoelectric element to measure an electrical property of the piezoelectric element. The piezoelectric elements of the stress detecting semiconductor chips are respectively disposed on the corresponding stress detecting semiconductor chips to be located at different positions from one another.

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patent: 7-235578 (1995-09-01), None
patent: 2005-209827 (2005-08-01), None

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