Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2005-03-25
2010-06-29
Landau, Matthew C (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S668000, C257S697000, C257S778000
Reexamination Certificate
active
07745912
ABSTRACT:
An apparatus, method, and system for providing a stress absorption layer for integrated circuits includes a stiffening layer adapted to limit flexing. A compliance layer is physically associated with the stiffening layer, with the compliance layer adapted to absorb stress caused by mismatched thermal properties between two materials. A thru hole passes through both the stiffening layer and the compliance layer, with the thru hole being adapted to receive a solder joint. The stress absorption layer contacts both a semiconductor package and a substrate. The solder joint disposed in the thru hole connects the semiconductor package to the substrate.
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Intel Corporation
Landau Matthew C
Mitchell James M
Schwabe Williamson & Wyatt P.C.
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