Drying and gas or vapor contact with solids – Process – With contacting of material treated with solid or liquid agent
Patent
1996-10-07
1998-01-20
Bennett, Henry A.
Drying and gas or vapor contact with solids
Process
With contacting of material treated with solid or liquid agent
34381, 34434, 34470, F26B 300
Patent
active
057090378
ABSTRACT:
A material to be dried, such as a semiconductor substrate during manufacturing a semiconductor device, is loaded into a process chamber fitted at a loading opening with a lid which is closed from above. The inner side wall surface of the process chamber has a first surface formed in the lower part thereof and is substantially in parallel with the inner wall surface of the lid, and a second surface extending from the upper end part of the first surface and bent outwards to face the inner wall surface of the lid. A processing solution vapor is fed through a steam supply port in the second surface into the process chamber and flowed downwardly over the material to be dried. The processing solution vapor is condensed and recovered below the material to be dried.
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Doi Nobuaki
Ishikawa Hiroaki
Omori Masashi
Tanaka Hiroshi
Bennett Henry A.
Gravini Steve
Mitsubishi Denki & Kabushiki Kaisha
Ryoden Semiconductor System Engineering Corporation
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