Stream drying process

Drying and gas or vapor contact with solids – Process – With contacting of material treated with solid or liquid agent

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Details

34381, 34434, 34470, F26B 300

Patent

active

057090378

ABSTRACT:
A material to be dried, such as a semiconductor substrate during manufacturing a semiconductor device, is loaded into a process chamber fitted at a loading opening with a lid which is closed from above. The inner side wall surface of the process chamber has a first surface formed in the lower part thereof and is substantially in parallel with the inner wall surface of the lid, and a second surface extending from the upper end part of the first surface and bent outwards to face the inner wall surface of the lid. A processing solution vapor is fed through a steam supply port in the second surface into the process chamber and flowed downwardly over the material to be dried. The processing solution vapor is condensed and recovered below the material to be dried.

REFERENCES:
patent: 4777970 (1988-10-01), Kusuhara
patent: 5273589 (1993-12-01), Griswold et al.
patent: 5331987 (1994-07-01), Hayashi et al.
patent: 5369891 (1994-12-01), Kamikawa
patent: 5371950 (1994-12-01), Schumacher
patent: 5443540 (1995-08-01), Kamikawa
patent: 5535525 (1996-07-01), Gardner
patent: 5539995 (1996-07-01), Bran
patent: 5575079 (1996-11-01), Yokomizo et al.

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