Stitch bond enhancement for hard-to-bond materials

Details Stitch bond enhancement for hard-to-bond materials Stitch bond enhancement for hard-to-bond materials

1998-09-23

1999-09-28

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438121, 257690, 2281805, H01L 2144, H01L 2148, H01L 2150

Patent

active

059602627

ABSTRACT:
A method of bonding a wire between a semiconductor die pad and a lead finger of a lead frame which includes providing a capillary having a bore and a wire pigtail extending through the bore and externally of the capillary. A ball is formed with the pigtail, a semiconductor die pad is provided and a ball bond is formed on the die pad with the ball. A lead frame finger is provided and the capillary and the wire threaded through the bore are moved to the lead frame finger. A stitch bond is formed on the lead finger with the capillary. The capillary is moved from the stitch bond with a pigtail of the wire extending out of the bore of the capillary. A second ball is formed with the pigtail and the capillary is again moved toward the stitch bond until the second ball contacts the stitch bond. A ball bond is then formed over and secured to the stitch bond and to the lead frame finger. The wire is preferably a gold alloy and the wire bond location includes a copper trace adhered to a flexible electrically insulating film.

REFERENCES:
patent: 5328079 (1994-07-01), Mathew
patent: 5735030 (1998-04-01), Orcutt

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