Stencil process for high resolution pattern replication

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156600, 427248R, 427282, 427307, 156656, 156657, 156661, C23C 1308

Patent

active

040135020

ABSTRACT:
A method and apparatus for the replication of thin film patterns. A stencil is fabricated of a material such as silicon by etching or epitaxially growing on the silicon wafer. The stencil is used as a shadow mask in molecular beam deposition of the thin film pattern. The technique provides high yields in the formation of relatively large scale thin film patterns.

REFERENCES:
patent: 3713922 (1973-01-01), Lepselter et al.
patent: 3718503 (1973-02-01), Glendinning et al.
patent: 3737346 (1973-06-01), Godfrey
patent: 3738881 (1973-06-01), Erdman et al.
patent: 3839108 (1974-10-01), Leinkram

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