Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1997-07-21
1999-03-09
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257783, 257676, 257669, 257672, H01L 2350, H01L 23495
Patent
active
058805222
ABSTRACT:
A lead frame for LOC is provided which, even when an adhesive is applied to a lead prepared by stamping, can ensure insulation of a semiconductor element mounted from the lead. In applying an adhesive to a predetermined position of an inner lead 1 in a lead frame prepared by stamping to form an adhesive layer 4, the adhesive layer 4 is provided on the droop face of the inner lead 1. The droop face has no burr and a bulged center portion, permitting contact, derived from the burr, between a lead face and a semiconductor element, to be avoided, which ensures satisfactory insulation of the semiconductor element mounted from the lead.
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Hagiya Shigeo
Sugimoto Hiroshi
Taketani Noriaki
Yonemoto Takaharu
Yoshioka Osamu
Hitachi Cable Ltd.
Williams Alexander Oscar
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