Stadium-stepped package for an integrated circuit with air diele

Details Stadium-stepped package for an integrated circuit with air diele Stadium-stepped package for an integrated circuit with air diele

1989-12-20

1991-04-16

Hille, Rolf

357 68, 357 80, H01L 2312, H01L 2348

Patent

active

050087347

ABSTRACT:
A package for containing an integrated circuit component is provided which includes one or more layers with exposed edges surrounding a central opening. The integrated circuit component is positioned in the central opening. Bond wires connect the bond pads of the integrated circuit component to the continuous shelves of the various stepped-back stadium-like layers as well as to individual insulated leads. The layers are spaced apart by beads or columns of insulative material and the major portion of the layers are separated from each other by a gaseous dielectric, preferably air. The R-C constant is reduced and the speed of transmission is increased by the presence of the low dielectric material providing a device which can function rapidly. The stepped portions of the layers are exposed to allow for electrical interconnections within the layers, as well as from each layer to the integrated circuit.

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