Stacking type semiconductor chip package

Details Stacking type semiconductor chip package Stacking type semiconductor chip package

1997-12-15

2000-07-11

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257692, 257777, H01L 2302

Patent

active

060877189

ABSTRACT:
A stacked-type semiconductor chip package of a lead on chip structure which is modified for stacking chips in the package, including a plurality of leads each having an inner lead portion and an outer lead portion extending from the inner lead portion, a lower semiconductor chip having a plurality of center pads and disposed under the inner lead portion, an upper semiconductor chip having a plurality of side pads and disposed above the inner lead portions, a plurality of side adhesive insulating members inserted between the inner lead portions and each of the upper and lower semiconductor chips, a plurality of wires which provide electrical connection between the pads and the inner lead portions, and a molding body which seals the structure other than the outer lead portions.

REFERENCES:
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5095402 (1992-03-01), Hernandez et al.
patent: 5327104 (1994-07-01), Kikushima
patent: 5332922 (1994-07-01), Oguchi et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5479051 (1995-12-01), Waki et al.
patent: 5545922 (1996-08-01), Golwalker et al.
patent: 5579208 (1996-11-01), Honda et al.
patent: 5689135 (1997-11-01), Ball

Affiliated with

Also associated with

Rating

Stacking type semiconductor chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacking type semiconductor chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacking type semiconductor chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-544744