Stacking circuit elements

Details Stacking circuit elements Stacking circuit elements

2007-05-01

2007-05-01

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S668000, C257S621000, C257S774000, C257SE21597

Reexamination Certificate

active

10937149

ABSTRACT:
A method of stacking dice in an electronic circuit includes controlling a size of a hole made in a connection pad on each die of said dice to selectively provide an electrical connection to a particular die in the stack. Additionally, a method of stacking dice in an electronic circuit includes forming holes in each of the dice, and providing electrical connection material selectively at some of the holes to provide for selective electrical connections among the dice. A stack of dice in an electronic circuit includes a number of dice stacked on top of each other, each die in the stack having one or more holes therein, conductive material extending through the holes and making electrical connection between one or more of the dice in the stack and the electronic circuit. An implantable stimulator with a stack of pulse generator integrated circuits (ICs) includes a number of pulse generator ICs stacked on top of each other, each IC having a number of holes formed therein, wherein the holes are aligned, and conductive material extending through the holes and making electrical connection between one or more of said ICs in the stack and an electronic circuit of the stimulator.

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