Stacking and soldering apparatus for three dimensional stack pac

Details Stacking and soldering apparatus for three dimensional stack pac Stacking and soldering apparatus for three dimensional stack pac

1996-12-20

1999-11-02

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 43, 228 495, B23K 300, B23K 3704

Patent

active

059754028

ABSTRACT:
A stacking and soldering apparatus for a three dimensional stack package devices includes a first base plate for receiving the first individual package devices to be stacked and having a heater for heating metal lead portions of the first individual package devices and; a second base plate for receiving the second individual package devices to be stacked and having a heater for heating metal lead portions of the second individual package devices. A package loader is used for transferring the individual packages to the first and the second base plates; and a transferring device is used for transferring the first individual package devices in the first base plate to the second base plate. A flux applying tool applies a solder flux to the metal lead portions of the first individual package devices during the transfer from the first to the second base plate; and a pick up tool picks up and places the transferred first individual package devices onto the second individual package devices so that the metal lead portions of the first individual package devices are in contact with the metal lead portions of the second individual package device. A solder joint is formed between the metal lead portions of the two individuals packages, either by thermo-compression of the pick up tool, or by heating of the second base plate.

REFERENCES:
patent: 3475805 (1969-11-01), Rottmann
patent: 3946931 (1976-03-01), Bahnck et al.
patent: 4602417 (1986-07-01), Mesch et al.

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