Stacked-type semiconductor package

Details Stacked-type semiconductor package Stacked-type semiconductor package

2008-05-20

2008-05-20

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S727000, C257S723000, C257S737000, C257S738000, C257SE23004, C257SE25023, C257SE21511

Reexamination Certificate

active

11291780

ABSTRACT:
Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tape. An electric length of the second signal transmission path is allowed to be adjusted independently of the first tape, so that the electric length of the second signal transmission path can be easily made equal to or substantially equal to that of the first signal transmission path.

REFERENCES:
patent: 6294837 (2001-09-01), Akram et al.
patent: 6473308 (2002-10-01), Forthun
patent: 2004/0227222 (2004-11-01), Kikuchi et al.
patent: 2004/0262733 (2004-12-01), Kumamoto
patent: 2005/0001302 (2005-01-01), Tanie et al.
patent: 2005/0083742 (2005-04-01), Hwang et al.
patent: 2005/0104181 (2005-05-01), Lee et al.
patent: 10-335580 (1998-12-01), None
patent: 11-220088 (1999-08-01), None
patent: 2003-133516 (2003-05-01), None
patent: 2003-338602 (2003-11-01), None
patent: 2004-282057 (2004-10-01), None
English translation of relevant portion of Japanese Office Action, issued in Corresponding Japanese Patent Application No. 2004-350620, dated Dec. 12, 2007.

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