Stacked solder balls for integrated circuit device packaging...

Details Stacked solder balls for integrated circuit device packaging... Stacked solder balls for integrated circuit device packaging...

2008-08-21

2010-12-07

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C257S780000, C257S779000, C257S738000, C257SE23023, C257SE23021, C257SE23069

Reexamination Certificate

active

07846829

ABSTRACT:
A semiconductor device is provided that includes a semiconductor chip, a plurality of solder bumps that electrically couple the semiconductor chip to the outside, and a metal bump being provided on the surface of each first solder bump which is at least a part of the plurality of solder bumps and being made of a metal having a melting point higher than that of the first solder bump. The wettability of the first solder bump is improved as each metal bump serves as a core when the corresponding first solder bump melts. Thus, the connection reliability of the first solder bump can be improved.

REFERENCES:
patent: 6541848 (2003-04-01), Kawahara et al.
patent: 6940178 (2005-09-01), Kweon et al.
patent: 7049217 (2006-05-01), Ishikawa et al.
patent: 7183648 (2007-02-01), Ramanathan et al.
patent: 7223695 (2007-05-01), Zhong et al.
patent: 2003/0096494 (2003-05-01), Sakuyama et al.

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