Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-12-18
2007-12-18
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S787000, C257SE25013, C257SE25018, C257SE25021, C257SE25027
Reexamination Certificate
active
10986510
ABSTRACT:
A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is mounted on the interposer.
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Chow Seng Guan
Han Byung Joon
Ramakrishna Kambhampati
Shim Il Kwon
Huynh Andy
Ishimaru Mikio
St Assembly Test Services Ltd.
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