Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate
2006-03-14
2006-03-14
Thompson, Craig A. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Small lead frame for connecting a large lead frame to a...
C257S666000, C438S111000, C438S112000, C029S827000
Reexamination Certificate
active
07012321
ABSTRACT:
A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.
REFERENCES:
patent: 4028722 (1977-06-01), Helda
patent: 5227995 (1993-07-01), Klink et al.
patent: 5296737 (1994-03-01), Nishimura et al.
patent: 5299092 (1994-03-01), Yaguchi et al.
patent: 5331235 (1994-07-01), Chun
patent: 5463253 (1995-10-01), Waki et al.
patent: 5491612 (1996-02-01), Nicewarner, Jr.
patent: 5508565 (1996-04-01), Hatakeyama et al.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5543658 (1996-08-01), Hosokawa et al.
patent: 5572068 (1996-11-01), Chun
patent: 5627828 (1997-05-01), Lee
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 5677569 (1997-10-01), Choi et al.
patent: 5744862 (1998-04-01), Ishii
patent: 5757080 (1998-05-01), Sota
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 5814881 (1998-09-01), Alagaratnam et al.
patent: 5917242 (1999-06-01), Ball
patent: 5939779 (1999-08-01), Kim
patent: 6046504 (2000-04-01), Kimura
patent: 6118176 (2000-09-01), Tao et al.
patent: 2-246125 (1990-10-01), None
patent: 7-58281 (1995-03-01), None
patent: 786526 (1995-03-01), None
U.S. Appln. Ser. No. 09/453,171, filed Dec. 2, 1999.
Kawamura Masayasu
Masuda Masachika
Nishizawa Hirotaka
Sugano Toshio
Sugiyama Michiaki
Antonelli Terry Stout & Kraus LLP
Berezny Nema
Hitachi , Ltd.
Hitachi ULSI Systems Co. Ltd.
Thompson Craig A.
LandOfFree
Stacked semiconductor device including improved lead frame... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked semiconductor device including improved lead frame..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked semiconductor device including improved lead frame... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3600048