Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-01-29
2008-01-29
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE23034
Reexamination Certificate
active
11411185
ABSTRACT:
A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and CSP are brought into proximity with each other. During solder reflow operation, a force is applied that tends to bring the combination and flex circuitry closer together. As the heat of solder reflow melts the contacts of the CSP, the combination collapses toward the flex circuitry displacing the adhesive as the solder paste and contacts merge into solder joints. In a preferred embodiment, the form standard will be devised of heat transference material, a metal, for example, such as copper would be preferred, to improve thermal performance. In other embodiments, the methods of the invention may be used to attach a CSP without a form standard to flex circuitry.
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Partridge Julian
Roper David
Wehrly, Jr. James Douglas
Fish & Richardson P.C.
Lebentritt Michael
Staktek Group L.P.
Stevenson André
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