Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2011-04-19
2011-04-19
Dang, Phuc T (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C438S050000, C438S052000
Reexamination Certificate
active
07928584
ABSTRACT:
A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
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Goggin Raymond
Harney Kieran P.
Murphy Eva
O Suilleabhain Liam
Analog Devices Inc.
Dang Phuc T
Sunstein Kann Murphy & Timbers LLP
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