Stacked mass storage flash memory package

Details Stacked mass storage flash memory package Stacked mass storage flash memory package

2007-08-28

2007-08-28

Pert, Evant (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S723000, C257S786000, C257SE21614, C257SE23123

Reexamination Certificate

active

10291075

ABSTRACT:
A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a maximum density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5147815 (1992-09-01), Casto
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5434745 (1995-07-01), Shokrgozar et al.
patent: 5478781 (1995-12-01), Bertin et al.
patent: 5483024 (1996-01-01), Russell et al.
patent: 5530287 (1996-06-01), Currie et al.
patent: 5585668 (1996-12-01), Burns
patent: 5585675 (1996-12-01), Knopf
patent: 5635010 (1997-06-01), Pepe et al.
patent: 5689135 (1997-11-01), Ball
patent: 5723906 (1998-03-01), Rush
patent: 5807762 (1998-09-01), Akram et al.
patent: 5899705 (1999-05-01), Akram
patent: 5952725 (1999-09-01), Ball
patent: 5963794 (1999-10-01), Fogal et al.
patent: 5973403 (1999-10-01), Wark
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6359340 (2002-03-01), Lin et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6376914 (2002-04-01), Kovats et al.
patent: 6461897 (2002-10-01), Lin et al.
patent: 6580035 (2003-06-01), Chung
patent: 6621155 (2003-09-01), Perino et al.
patent: 6784019 (2004-08-01), Huang
patent: 6900528 (2005-05-01), Mess et al.
patent: 2001/0015485 (2001-08-01), Song et al.
patent: 56-158467 (1981-12-01), None
patent: 62-6534 (1987-01-01), None
patent: 63-104343 (1988-05-01), None
patent: 3-165550 (1991-07-01), None
patent: 5-13665 (1993-01-01), None

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