Stacked integrated circuit package system with connection...

Details Stacked integrated circuit package system with connection... Stacked integrated circuit package system with connection...

2006-04-01

2008-10-28

Chu, Chris C. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE27137, C257S685000, C257S686000, C257S723000, C438S108000, C438S109000, C361S760000

Reexamination Certificate

active

07443037

ABSTRACT:
A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate, applying a protective dot on the first integrated circuit device, mounting a second integrated circuit device, having an adhesive, on the protective dot, with the adhesive on the first integrated circuit device, connecting the second integrated circuit device and the substrate, and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.

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