Stacked electronic component package having film-on-wire spacer

Details Stacked electronic component package having film-on-wire spacer Stacked electronic component package having film-on-wire spacer

2010-01-20

2011-12-06

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE25018, C257S685000, C257S686000, C438S109000, C361S760000

Reexamination Certificate

active

08072083

ABSTRACT:
A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic component, e.g., during wirebonding, and thus decreases the chance of cracking the upper electronic component. Further, the lower bond wires are enclosed in and protected by the film-on-wire spacer. Further, the film-on-wire spacer is thin resulting in a minimum height of the stacked electronic component package.

REFERENCES:
patent: 3880528 (1975-04-01), Petersen et al.
patent: 4055761 (1977-10-01), Shimomura
patent: 4491865 (1985-01-01), Danna et al.
patent: 4567643 (1986-02-01), Droguet et al.
patent: 4763188 (1988-08-01), Johnson
patent: 4896217 (1990-01-01), Miyazawa et al.
patent: 4947234 (1990-08-01), Einzinger et al.
patent: 4999142 (1991-03-01), Fukushima et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5023442 (1991-06-01), Taniguchi et al.
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5068713 (1991-11-01), Toda
patent: 5122861 (1992-06-01), Tamura et al.
patent: 5220198 (1993-06-01), Tsuji
patent: 5274456 (1993-12-01), Izumi et al.
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5328079 (1994-07-01), Mathew et al.
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5365101 (1994-11-01), Tonai
patent: 5383034 (1995-01-01), Imamura et al.
patent: 5400072 (1995-03-01), Izumi et al.
patent: 5412229 (1995-05-01), Kuhara et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5434682 (1995-07-01), Imamura et al.
patent: 5436492 (1995-07-01), Yamanaka
patent: 5444520 (1995-08-01), Murano
patent: 5463229 (1995-10-01), Takase et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5489995 (1996-02-01), Iso et al.
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 5570204 (1996-10-01), Kumashiro
patent: 5581094 (1996-12-01), Hara et al.
patent: 5604362 (1997-02-01), Jedlicka et al.
patent: 5617131 (1997-04-01), Murano et al.
patent: 5655189 (1997-08-01), Murano
patent: 5672902 (1997-09-01), Hatanaka et al.
patent: 5689135 (1997-11-01), Ball
patent: 5696031 (1997-12-01), Wark
patent: 5715147 (1998-02-01), Nagano
patent: 5721452 (1998-02-01), Fogal et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5783815 (1998-07-01), Ikeda
patent: 5804004 (1998-09-01), Tuckerman et al.
patent: 5804827 (1998-09-01), Akagawa et al.
patent: 5811799 (1998-09-01), Wu
patent: 5815372 (1998-09-01), Gallas
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5825560 (1998-10-01), Ogura et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5866949 (1999-02-01), Schueller
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5888606 (1999-03-01), Senoo et al.
patent: 5894380 (1999-04-01), Sasada et al.
patent: 5902993 (1999-05-01), Okushiba et al.
patent: 5904497 (1999-05-01), Akram
patent: 5932875 (1999-08-01), Chung et al.
patent: 5952725 (1999-09-01), Ball
patent: 5973403 (1999-10-01), Wark
patent: 5998878 (1999-12-01), Johnson
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6011294 (2000-01-01), Wetzel
patent: 6011661 (2000-01-01), Weng
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020582 (2000-02-01), Bawolek et al.
patent: RE36613 (2000-03-01), Ball
patent: 6037655 (2000-03-01), Philbrick et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6057598 (2000-05-01), Payne et al.
patent: 6060722 (2000-05-01), Havens et al.
patent: 6072232 (2000-06-01), Li et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 6080264 (2000-06-01), Ball
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6118176 (2000-09-01), Tao et al.
patent: 6122009 (2000-09-01), Ueda
patent: 6130448 (2000-10-01), Bauer et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6140149 (2000-10-01), Wark
patent: 6147389 (2000-11-01), Stern et al.
patent: 6153927 (2000-11-01), Raj et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6163076 (2000-12-01), Lee et al.
patent: 6184514 (2001-02-01), Rezende et al.
patent: 6214641 (2001-04-01), Akram
patent: 6215193 (2001-04-01), Tao et al.
patent: 6252305 (2001-06-01), Lin et al.
patent: 6258626 (2001-07-01), Wang et al.
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6326696 (2001-12-01), Horton et al.
patent: 6333562 (2001-12-01), Lin
patent: 6339255 (2002-01-01), Shin
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6351028 (2002-02-01), Akram
patent: 6359340 (2002-03-01), Lin et al.
patent: 6365966 (2002-04-01), Chen et al.
patent: 6380615 (2002-04-01), Park et al.
patent: 6384397 (2002-05-01), Takiar et al.
patent: 6384472 (2002-05-01), Huang
patent: 6387728 (2002-05-01), Pai et al.
patent: 6388313 (2002-05-01), Lee et al.
patent: 6392703 (2002-05-01), Uchino et al.
patent: 6414381 (2002-07-01), Takeda
patent: 6437449 (2002-08-01), Foster
patent: 6461897 (2002-10-01), Lin et al.
patent: 6472758 (2002-10-01), Glenn et al.
patent: 6476475 (2002-11-01), Lee
patent: 6498624 (2002-12-01), Ogura et al.
patent: 6500698 (2002-12-01), Shin
patent: 6503776 (2003-01-01), Pai et al.
patent: 6509560 (2003-01-01), Glenn et al.
patent: 6518656 (2003-02-01), Nakayama et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 6545365 (2003-04-01), Kondo et al.
patent: 6552416 (2003-04-01), Foster
patent: 6555917 (2003-04-01), Heo
patent: 6559526 (2003-05-01), Lee et al.
patent: 6576997 (2003-06-01), Uchida
patent: 6593662 (2003-07-01), Pu et al.
patent: 6603072 (2003-08-01), Foster et al.
patent: 6620651 (2003-09-01), He et al.
patent: 6621156 (2003-09-01), Kimura
patent: 6627480 (2003-09-01), Kim
patent: 6627864 (2003-09-01), Glenn et al.
patent: 6627872 (2003-09-01), FuKamura et al.
patent: 6650019 (2003-11-01), Glenn et al.
patent: 6657290 (2003-12-01), Fukui et al.
patent: 6710455 (2004-03-01), Goller et al.
patent: 6713857 (2004-03-01), Tsai
patent: 6730543 (2004-05-01), Akram
patent: 6737299 (2004-05-01), Jiang
patent: 6762796 (2004-07-01), Nakajoh et al.
patent: 6767753 (2004-07-01), Huang
patent: 6798049 (2004-09-01), Shin et al.
patent: 6833287 (2004-12-01), Hur et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6849950 (2005-02-01), Matsuura
patent: 6857470 (2005-02-01), Park et al.
patent: 6867438 (2005-03-01), Maruyama et al.
patent: 6885093 (2005-04-01), Lo et al.
patent: 6894380 (2005-05-01), Jiang et al.
patent: 6911723 (2005-06-01), Akram
patent: 6937477 (2005-08-01), Wu
patent: 6977439 (2005-12-01), Kang et al.
patent: 7176558 (2007-02-01), Kang et al.
patent: 7205651 (2007-04-01), Do et al.
patent: 7227086 (2007-06-01), Lee et al.
patent: 7285864 (2007-10-01), Takyu et al.
patent: 7323786 (2008-01-01), Sasaki
patent: 7485490 (2009-02-01), Oh et al.
patent: 7633144 (2009-12-01), Kim et al.
patent: 2001/0023994 (2001-09-01), Oka
patent: 2002/0001869 (2002-01-01), Fjelstad
patent: 2002/0014689 (2002-02-01), Lo et al.
patent: 2002/0030262 (2002-03-01), Akram
patent: 2002/0030263 (2002-03-01), Akram
patent: 2002/0050642 (2002-05-01), Oota et al.
patent: 2002/0064905 (2002-05-01), Park et al.
patent: 2002/0096755 (2002-07-01), Fukui et al.
patent: 2002/0109216 (2002-08-01), Matsuzaki et al.
patent: 2002/0125556 (2002-09-01), Oh et al.
patent: 2002/0130398 (2002-09-01), Huang
patent: 2002/0171136 (2002-11-01), Hiraoka et al.
patent: 2002/0195624 (2002-12-01), Glenn et al.
patent: 2003/0001252 (2003-01-01), Ku et al.
patent: 2003/0038355 (2003-02-01), Derderian
patent: 2003/0038356 (2003-02-01), Derderian
patent: 2003/0038357 (2003-02-01), Derderian
patent: 2003/0047754 (2003-03-01), Hsu et al.
patent: 2003/0127719 (2003-07-01), Chang
patent: 2003/0137042 (2003-07-01), Mess et al.
patent: 2003/0137595 (2003-07-01), Takachi
patent: 2003/0178710 (2003-09-01), Kang et al.
patent: 2003/0178715 (2003-09-01), Sturcken et al.
patent: 2003/0189259 (2003-10-01), Kurita et al.
patent: 2003/0199118 (2003-10-01), Park et al.
patent: 2004/0041249 (2004-03-01), Tsai et al.
patent: 2004/0051168 (2004-03-01), Arai et al.
patent: 2004/0101631 (2004-05-01), Uragami et

Affiliated with

Also associated with

Rating

Stacked electronic component package having film-on-wire spacer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked electronic component package having film-on-wire spacer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked electronic component package having film-on-wire spacer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4257587