Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-12-18
2009-08-18
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S125000, C438S617000, C257S619000, C257S777000, C257S784000
Reexamination Certificate
active
07575953
ABSTRACT:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
REFERENCES:
patent: 3449640 (1969-06-01), Franklin
patent: 4571611 (1986-02-01), Kashiwagi
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5760478 (1998-06-01), Bozso et al.
patent: 5804004 (1998-09-01), Tuckerman et al.
patent: 5837566 (1998-11-01), Pedersen et al.
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5904497 (1999-05-01), Akram
patent: 5910686 (1999-06-01), Hamzehdoost et al.
patent: 5952725 (1999-09-01), Ball
patent: 5985695 (1999-11-01), Freyman et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6052287 (2000-04-01), Palmer et al.
patent: 6080264 (2000-06-01), Ball
patent: 6081997 (2000-07-01), Chia et al.
patent: 6084308 (2000-07-01), Kelkar et al.
patent: 6165815 (2000-12-01), Ball
patent: 6207474 (2001-03-01), King et al.
patent: 6222265 (2001-04-01), Akram et al.
patent: 6239484 (2001-05-01), Dore et al.
patent: 6262488 (2001-07-01), Masayuki et al.
patent: 6271056 (2001-08-01), Farnworth et al.
patent: 6294839 (2001-09-01), Mess et al.
patent: 6297548 (2001-10-01), Moden et al.
patent: 6340842 (2002-01-01), Nakamura
patent: 6351028 (2002-02-01), Akram
patent: 6380615 (2002-04-01), Park et al.
patent: 6380631 (2002-04-01), Mess et al.
patent: 6407456 (2002-06-01), Ball
patent: 6472758 (2002-10-01), Glenn
patent: 6476475 (2002-11-01), Lee
patent: 6483187 (2002-11-01), Chao et al.
patent: 6512302 (2003-01-01), Mess et al.
patent: 6525413 (2003-02-01), Cloud et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 6558966 (2003-05-01), Mess et al.
patent: 6563205 (2003-05-01), Fogal et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 6730543 (2004-05-01), Akram
patent: 6731009 (2004-05-01), Jones et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6777797 (2004-08-01), Egawa
patent: 6784023 (2004-08-01), Ball
patent: 6818998 (2004-11-01), Kwon et al.
patent: 6833287 (2004-12-01), Hur et al.
patent: 6861760 (2005-03-01), Oka et al.
patent: 6906408 (2005-06-01), Cloud et al.
patent: 6919631 (2005-07-01), Hoffman et al.
patent: 6939746 (2005-09-01), Bolken
patent: 6984544 (2006-01-01), Cloud et al.
patent: 7282392 (2007-10-01), Tan et al.
patent: 7309623 (2007-12-01), Tan et al.
patent: 7332819 (2008-02-01), Tan et al.
patent: 7371608 (2008-05-01), Tan et al.
patent: 2002/0096754 (2002-07-01), Chen et al.
patent: 2003/0111720 (2003-06-01), Tan et al.
patent: 10209204 (2003-10-01), None
patent: 1093165 (2001-04-01), None
patent: 62185348 (1987-08-01), None
patent: 02109410 (1990-04-01), None
patent: 6244360 (1994-09-01), None
patent: 11289023 (1999-10-01), None
patent: 2000049279 (2000-02-01), None
patent: 2000058742 (2000-02-01), None
patent: 2003282818 (2003-10-01), None
IBM Research Disclosure RD41388 (N.N.), Sep. 1, 1998.
Chew Beng Chye
Lim Thiam Chye
Neo Chee Peng
Pour Cheng Poh
Tan Hock Chuan
Chambliss Alonzo
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
LandOfFree
Stacked die with a recess in a die BGA package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked die with a recess in a die BGA package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked die with a recess in a die BGA package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4106569