Stacked die with a recess in a die BGA package

Details Stacked die with a recess in a die BGA package Stacked die with a recess in a die BGA package

2007-12-18

2009-08-18

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S125000, C438S617000, C257S619000, C257S777000, C257S784000

Reexamination Certificate

active

07575953

ABSTRACT:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

REFERENCES:
patent: 3449640 (1969-06-01), Franklin
patent: 4571611 (1986-02-01), Kashiwagi
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5760478 (1998-06-01), Bozso et al.
patent: 5804004 (1998-09-01), Tuckerman et al.
patent: 5837566 (1998-11-01), Pedersen et al.
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5904497 (1999-05-01), Akram
patent: 5910686 (1999-06-01), Hamzehdoost et al.
patent: 5952725 (1999-09-01), Ball
patent: 5985695 (1999-11-01), Freyman et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6052287 (2000-04-01), Palmer et al.
patent: 6080264 (2000-06-01), Ball
patent: 6081997 (2000-07-01), Chia et al.
patent: 6084308 (2000-07-01), Kelkar et al.
patent: 6165815 (2000-12-01), Ball
patent: 6207474 (2001-03-01), King et al.
patent: 6222265 (2001-04-01), Akram et al.
patent: 6239484 (2001-05-01), Dore et al.
patent: 6262488 (2001-07-01), Masayuki et al.
patent: 6271056 (2001-08-01), Farnworth et al.
patent: 6294839 (2001-09-01), Mess et al.
patent: 6297548 (2001-10-01), Moden et al.
patent: 6340842 (2002-01-01), Nakamura
patent: 6351028 (2002-02-01), Akram
patent: 6380615 (2002-04-01), Park et al.
patent: 6380631 (2002-04-01), Mess et al.
patent: 6407456 (2002-06-01), Ball
patent: 6472758 (2002-10-01), Glenn
patent: 6476475 (2002-11-01), Lee
patent: 6483187 (2002-11-01), Chao et al.
patent: 6512302 (2003-01-01), Mess et al.
patent: 6525413 (2003-02-01), Cloud et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 6558966 (2003-05-01), Mess et al.
patent: 6563205 (2003-05-01), Fogal et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 6730543 (2004-05-01), Akram
patent: 6731009 (2004-05-01), Jones et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6777797 (2004-08-01), Egawa
patent: 6784023 (2004-08-01), Ball
patent: 6818998 (2004-11-01), Kwon et al.
patent: 6833287 (2004-12-01), Hur et al.
patent: 6861760 (2005-03-01), Oka et al.
patent: 6906408 (2005-06-01), Cloud et al.
patent: 6919631 (2005-07-01), Hoffman et al.
patent: 6939746 (2005-09-01), Bolken
patent: 6984544 (2006-01-01), Cloud et al.
patent: 7282392 (2007-10-01), Tan et al.
patent: 7309623 (2007-12-01), Tan et al.
patent: 7332819 (2008-02-01), Tan et al.
patent: 7371608 (2008-05-01), Tan et al.
patent: 2002/0096754 (2002-07-01), Chen et al.
patent: 2003/0111720 (2003-06-01), Tan et al.
patent: 10209204 (2003-10-01), None
patent: 1093165 (2001-04-01), None
patent: 62185348 (1987-08-01), None
patent: 02109410 (1990-04-01), None
patent: 6244360 (1994-09-01), None
patent: 11289023 (1999-10-01), None
patent: 2000049279 (2000-02-01), None
patent: 2000058742 (2000-02-01), None
patent: 2003282818 (2003-10-01), None
IBM Research Disclosure RD41388 (N.N.), Sep. 1, 1998.

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