Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-05-16
2006-05-16
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
active
07045390
ABSTRACT:
A stacked die package is formed by stiffening a flexible substrate, arranging a chip mounting pattern on one side of the substrate, and mounting chips according to the arranged pattern. A solder ball array on the opposite side of the substrate is routed to the chips, and the flexible substrate and stiffener are folded to align the chips in the stacked die package. The stiffener is removed by a single saw cut.
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Hubbard Robert L.
Milla Juan G.
Barry Caroline F.
Medtronic Inc.
Wolde-Michael Girma
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