Stacked chip packaging with heat sink structure

Details Stacked chip packaging with heat sink structure Stacked chip packaging with heat sink structure

2007-08-02

2010-02-16

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S666000, C257S670000, C257S686000, C257S723000, C257SE25005, C257SE25006, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

07663246

ABSTRACT:
A stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, in which the die pad is provided between the inner leads and is vertically distant from the inner leads; a bus bar being provided between the inner leads and the die pad; an offset chip-stacked structure stacked by a plurality of chips, the offset chip-stacked structure being fixedly connected to a first surface of the die pad and electrically connected to the inner leads; and an encapsulant covering the offset chip-stacked structure, the inner leads, the first surface of die pad, and the upper surface of bus bar, the second surface of die pad and the lower surface of bus bar being exposed and the outer leads extending out of the encapsulant.

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