Stackable semiconductor package having metal pin within...

Details Stackable semiconductor package having metal pin within... Stackable semiconductor package having metal pin within...

2007-06-06

2010-02-02

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With housing mount

C257S690000, C257S693000, C257S698000, C257S723000, C257SE33056, C257SE23001

Reexamination Certificate

active

07656031

ABSTRACT:
The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.

REFERENCES:
patent: 2006/0091542 (2006-05-01), Zhao et al.
patent: 2006/0252180 (2006-11-01), Moden et al.
patent: 2006/0259093 (2006-11-01), Stevenson et al.
patent: 2007/0290376 (2007-12-01), Zhao et al.
patent: 2008/0253085 (2008-10-01), Soffer

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