Stackable semiconductor package

Details Stackable semiconductor package Stackable semiconductor package

2006-12-12

2009-06-23

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S724000, C257S784000, C257SE25013, C257SE21164, C361S777000, C361S784000, C361S780000, C361S792000

Reexamination Certificate

active

07550832

ABSTRACT:
A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is exposed. The top package is inverted, and is adhered to the chip of the bottom package with the adhesive layer. The wires electrically connect a substrate of the bottom package and a substrate of the top package. The molding compound encapsulates the top package, the bottom package, the adhesive layer,and the wires, and exposes a part of a surface of the substrate of the top package. Thus, the stackable semiconductor package includes at least two chips, thereby increasing the chip density and improving the applicability.

REFERENCES:
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6501165 (2002-12-01), Farnworth et al.
patent: 6521881 (2003-02-01), Tu et al.
patent: 6593662 (2003-07-01), Pu et al.
patent: 6614101 (2003-09-01), Misumi et al.
patent: 6828665 (2004-12-01), Pu et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6861288 (2005-03-01), Shim et al.
patent: 7071568 (2006-07-01), St. Amand et al.
patent: 7354800 (2008-04-01), Carson
patent: 7372141 (2008-05-01), Karnezos et al.
patent: 7456495 (2008-11-01), Pohl et al.
patent: 2004/0056277 (2004-03-01), Karnezos
patent: 2004/0124518 (2004-07-01), Karnezos
patent: 2004/0262774 (2004-12-01), Kang et al.
patent: 2005/0017340 (2005-01-01), Shibue
patent: 2005/0133916 (2005-06-01), Karnezos
patent: 2005/0248019 (2005-11-01), Chao et al.
patent: 2007/0052089 (2007-03-01), Kim et al.
patent: 2007/0096160 (2007-05-01), Beroz et al.
patent: 2007/0246815 (2007-10-01), Lu et al.
patent: 2008/0029869 (2008-02-01), Kwon et al.
patent: 2004043739 (2004-05-01), None
patent: 507340 (1999-10-01), None
patent: 571420 (2004-01-01), None
patent: I227533 (2005-02-01), None
patent: I227924 (2005-02-01), None
patent: 200522303 (2005-07-01), None
patent: I244175 (2005-11-01), None
patent: 200611305 (2006-04-01), None

Affiliated with

Also associated with

Rating

Stackable semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stackable semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stackable semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4090126