Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-01-04
2011-01-04
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE21506, C257S685000, C257S723000, C257S777000, C438S106000, C438S109000, C438S113000
Reexamination Certificate
active
07863722
ABSTRACT:
Stacked semiconductor devices and assemblies including attached lead frames are disclosed herein. One embodiment of a method of manufacturing a semiconductor assembly includes forming a plurality of first side trenches to a first intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes forming a plurality of lateral contacts at sidewall portions of the trenches and electrically connecting first side bond-sites of the dies with corresponding lateral contacts of the trenches. The method further includes forming a plurality of second side channels to a second intermediate depth in the molded portion such that the channels intersect the trenches. The method also includes singulating and stacking the first and second dies with the channels associated with the first die aligned with channels associated with the second die. The method further includes attaching a lead frame to the lateral contacts of the stacked first and second dies.
REFERENCES:
patent: 4930216 (1990-06-01), Nelson
patent: 5266833 (1993-11-01), Capps
patent: 5834162 (1998-11-01), Malba
patent: 5888884 (1999-03-01), Wojnarowski
patent: 6372623 (2002-04-01), Hoffman et al.
patent: 6391685 (2002-05-01), Hikita et al.
patent: 6412971 (2002-07-01), Wojnarowski et al.
patent: 6521995 (2003-02-01), Akram et al.
patent: 6528393 (2003-03-01), Tao
patent: 6727116 (2004-04-01), Poo et al.
patent: 6730579 (2004-05-01), Sasaka
patent: 6818977 (2004-11-01), Poo et al.
patent: 6855572 (2005-02-01), Jeung et al.
patent: 6949407 (2005-09-01), Jeung et al.
patent: 7022552 (2006-04-01), Yamaguchi
patent: 7115483 (2006-10-01), Kwon et al.
patent: 7115984 (2006-10-01), Poo et al.
patent: 7193312 (2007-03-01), Boon et al.
patent: 7199449 (2007-04-01), Lake
patent: 7208335 (2007-04-01), Boon et al.
patent: 7375009 (2008-05-01), Chua et al.
patent: 7511379 (2009-03-01), Flint, Jr.
patent: 7585750 (2009-09-01), Do et al.
patent: 7618903 (2009-11-01), Chae
patent: 7659145 (2010-02-01), Do et al.
patent: 7674655 (2010-03-01), Chua et al.
patent: 7713785 (2010-05-01), Flint, Jr.
patent: 2002/0139577 (2002-10-01), Miller
patent: 2003/0232488 (2003-12-01), Chua et al.
patent: 2004/0070087 (2004-04-01), Wang et al.
patent: 2004/0183185 (2004-09-01), Badihi
patent: 2004/0221451 (2004-11-01), Chia et al.
patent: 2005/0181540 (2005-08-01), Farnworth et al.
patent: 2006/0197206 (2006-09-01), Kim et al.
patent: 2006/0228825 (2006-10-01), Hembree
patent: 2006/0228832 (2006-10-01), Koh
patent: 2007/0029666 (2007-02-01), Goh et al.
patent: 2007/0126091 (2007-06-01), Wood et al.
patent: 2007/0176275 (2007-08-01), Singleton et al.
patent: 2007/0235851 (2007-10-01), Ware et al.
patent: 2008/0036065 (2008-02-01), Brunnbauer et al.
patent: 2008/0054432 (2008-03-01), Corisis et al.
patent: 2008/0169546 (2008-07-01), Kwon et al.
patent: 2008/0211113 (2008-09-01), Chua et al.
patent: 2009/0230569 (2009-09-01), Donis et al.
patent: 102004041889 (2006-03-01), None
patent: 102005003125 (2006-07-01), None
patent: 11274354 (1999-10-01), None
patent: 20030032313 (2003-04-01), None
Furgut, E. et al., “Taking Wafer Level Packaging to the Next Stage: A 200mm Silicon Technology Compatible Embedded Device Technology,” Advanced Packaging Conference, SEMICON Europa 2006, Munich, Germany, Apr. 4, 2006.
U.S. Appl. No. 11/933,754, filed Nov. 1, 2007, Chua et al.
Chu Chris
Micro)n Technology, Inc.
Perkins Coie LLP
LandOfFree
Stackable semiconductor assemblies and methods of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stackable semiconductor assemblies and methods of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stackable semiconductor assemblies and methods of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2740598