Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-08-28
2010-10-19
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S686000, C257S784000, C257S787000, C257SE23043
Reexamination Certificate
active
07816769
ABSTRACT:
An apparatus and a method for packaging semiconductor devices. The apparatus includes a substrate strip component of a leadless three-dimensional stackable semiconductor package having mounting contacts on, for example, four peripheral edges. The substrate strip may either be fabricated for mounting a single electrical component (e.g., an integrated circuit die) or a plurality of substrate strips may be laid out in an X-Y matrix pattern which may later be singulated into individual package strip for leadless packages. Three-dimensional stacking is achieved by a bonding area on an uppermost portion of the sidewall. The sidewall of the strip is high enough to enclose an encapsulant covering a later mounted integrated circuit die and associated bonding wires.
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Atmel Corporation
Parekh Nitin
Schwegman Lundberg & Woessner, P.A.
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