Stackable motherboard and related sensor systems

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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Details

C716S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

07451410

ABSTRACT:
The stackable motherboard10of the first embodiment includes: a circuit board19having a first side14and a second side17opposite the first side14, a processor16mounted on the circuit board19, a first peripheral interconnect18, and a second peripheral interconnect90. The stackable motherboard10also preferably includes: a first motherboard interconnect99mounted on the first side14of the circuit board19and adapted to communicate data between the processor16and a first auxiliary motherboard, and a second motherboard interconnect94mounted on the second side17of the circuit board19and adapted to communicate data between the processor16and a second auxiliary motherboard.

REFERENCES:
patent: 6086629 (2000-07-01), McGettigan et al.
patent: 6301695 (2001-10-01), Burnham et al.
patent: 6370677 (2002-04-01), Carruthers et al.
patent: 6438737 (2002-08-01), Morelli et al.
patent: 6457164 (2002-09-01), Hwang et al.
patent: 6526563 (2003-02-01), Baxter
patent: 6557156 (2003-04-01), Guccione
patent: 2003/0086300 (2003-05-01), Noyes et al.
patent: 2003/0101426 (2003-05-01), Sarkinen et al.
patent: 2003/0160980 (2003-08-01), Olsson et al.
PC/104 Specification Version 2.5 Nov. 2003.
PC/104-Plus Specification Version 2.0 Nov. 2003.

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