Stack-type semiconductor package sockets and stack-type...

Details Stack-type semiconductor package sockets and stack-type... Stack-type semiconductor package sockets and stack-type...

2007-10-22

2008-10-14

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB, C257S048000

Reexamination Certificate

active

07436199

ABSTRACT:
A stack-type semiconductor package socket may include: a first package connection portion for connection with leads of a lowermost package of a stack-type semiconductor package; a second package connection portion for connection between pads of an odd-numbered package and leads of an even-numbered package, wherein the odd-numbered package and the even-numbered package are adjacent to each other; a lower case for fixing the first package connection portion; and an upper case for fixing the second package connection portion. A stack-type semiconductor package test system may include: a stack-type semiconductor package socket that includes first and second package connection portions; a printed circuit board electrically connected to leads of the lowermost package through the first package connection portion; and a test controller for receiving, outputting, or receiving and outputting signals from, to, or from and to the stack-type semiconductor package through the PCB and the stack-type semiconductor package socket.

REFERENCES:
patent: 3492538 (1970-01-01), Fergusson
patent: 6407566 (2002-06-01), Brunelle et al.
patent: 6967397 (2005-11-01), Inoue et al.
patent: 2000-304808 (2000-11-01), None
patent: 2004-271428 (2004-09-01), None
patent: 10-1998-0012659 (1998-04-01), None
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patent: 101998022524 (1998-07-01), None
patent: 10-0417267 (2001-10-01), None
patent: 1020020064060 (2002-08-01), None
Notice of Allowability issued on Mar. 31, 2008, for corresponding Korean Patent Application No. 10-2006-0103632.

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