Stack package and semiconductor module implementing the same

Details Stack package and semiconductor module implementing the same Stack package and semiconductor module implementing the same

2006-01-13

2010-06-08

Parker, Kenneth A (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257S731000, C257S750000, C257S777000, C257S786000, C257S784000, C257S778000, C257S685000, C361S614000, C361S667000, C361S735000, C361S748000, C361S767000

Reexamination Certificate

active

07732905

ABSTRACT:
The stack package may have a structure in which unit packages may be inserted into slots of a receiving substrate. The unit package may have a plurality of connecting pads. The receiving substrate may have substrate pads, which may be electrically connected to the connecting pads of the unit packages inserted in the slots by mechanical contact. The slots may be provided at regular vertical intervals so that the unit packages may be stacked in the vertical direction. A semiconductor module may include stack packages installed on at least one surface of a module substrate.

REFERENCES:
patent: 5313096 (1994-05-01), Eide
patent: 5604377 (1997-02-01), Palagonia
patent: 6818980 (2004-11-01), Pedron, Jr.
patent: 7250675 (2007-07-01), Fasano et al.
patent: 2002/0070447 (2002-06-01), Kinsman
patent: 2003/0067064 (2003-04-01), Kim
patent: 2005/0110168 (2005-05-01), Chuang
patent: 2005/0133897 (2005-06-01), Baek et al.
patent: 11-111914 (1999-04-01), None
patent: 100256307 (2000-02-01), None
patent: 1020020002521 (2002-01-01), None

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