Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1997-04-18
1999-03-16
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257713, 257723, H01L 2302
Patent
active
058834265
ABSTRACT:
A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.
REFERENCES:
patent: 5528456 (1996-06-01), Takahashi
Nobuaki Takahashi et al., "3-Dimensional Memory Module", NEC Corporation, Japan, pp. 1-7.
Bonkohara Manabu
Doya Akihiro
Morisaki Ikushi
Senba Naoji
Shimada Yuuzou
Brown Peter Toby
NEC Corporation
Potter Roy
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