Stable non-photosensitive polyimide precursor compositions...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S325000, C430S326000, C430S327000, C430S329000, C430S330000, C430S331000

Reexamination Certificate

active

07018776

ABSTRACT:
Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide precursor compositions comprisea) one or more polyamic acids soluble in gamma-butyrolactone (GBL) and aqueous tetramethyl ammonium hydroxide, and with the proviso that the polyamic acid is also resistant to a solvent used in a photosensitive composition with which the polyimide precursor composition is to be used;b) a solvent comprising gamma-butyrolactone; andc) one or more adhesion promoters selected from structures described by Formulae I–VIwherein R1is H, C1–C10linear, cyclic or branched alkyl, phenyl or halophenyl or alkyl substituted phenyl, R2is C1–C10linear, cyclic or branched alkyl, phenyl, halophenyl or alkyl substituted phenyl or one of the following moieties VII, VIII, or IXwhere R3is C1–C4linear or branched alkyl or C1–C4linear or branched alkoxy group, R4, R5and R6are independently C1–C4linear or branched alkyl group, m is an integer from 1 to about 4, and n is an integer from 1 to about 5.

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patent: 2002/0100550 (2002-08-01), Mahdi et al.
patent: 2005/0058780 (2005-03-01), Ono et al.

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