Stabilization process for aluminum microcircuits which have been

Details Stabilization process for aluminum microcircuits which have been Stabilization process for aluminum microcircuits which have been

1978-09-25

1980-01-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156656, 204192E, 427 88, 427383A, C23F 102

Patent

active

041837819

ABSTRACT:
Aluminum microcircuits which have been prepared by reactive-ion etching are stabilized against open circuits and short circuits by treating the microcircuits in an oxygen-containing atmosphere at a temperature of from about 200.degree. C. to about 450.degree. C.

REFERENCES:
patent: 3753768 (1973-08-01), Ichiki et al.
patent: 4026742 (1977-05-01), Fujino
patent: 4057460 (1977-11-01), Saxena

Affiliated with

Also associated with

Rating

Stabilization process for aluminum microcircuits which have been does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stabilization process for aluminum microcircuits which have been, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stabilization process for aluminum microcircuits which have been will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1027453