SRAM cell structure with dielectric sidewall spacers and drain a

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257903, 257393, 438199, H01L 2976, H01L 2994, H01L 31062, H01L 31116

Patent

active

061406848

ABSTRACT:
A six transistor static random access memory (SRAM) cell with thin-film pull-up transistors and method of making the same includes providing two bulk silicon pull-down transistors of a first conductivity type, two active gated pull-up thin-film transistors (TFTs) of a second conductivity type, two pass gates, a common word line, and two bit line contacts. The bulk silicon pull-down transistors, two active gated pull-up TFTs, and two pass gates are connected at four shared contacts. In addition, the two bulk silicon pull-down transistors and the two active gated pull-up TFTs are formed with two polysilicon layers, a first of the polysilicon layers (poly1) is salicided and includes poly1 gate electrodes for the two bulk silicon pull-down transistors. A second of the polysilicon layers (poly2) includes desired poly2 stringers disposed along side edges of the poly1 gate electrodes, the desired poly2 stringers forming respective channel regions of the pull-up TFTs.

REFERENCES:
patent: 4072974 (1978-02-01), Ipri
patent: 4118642 (1978-10-01), Richardson
patent: 4178674 (1979-12-01), Liu et al.
patent: 4180826 (1979-12-01), Shappir
patent: 4214917 (1980-07-01), Clark et al.
patent: 4247915 (1981-01-01), Bartlett
patent: 4290185 (1981-09-01), McKenny et al.
patent: 4367580 (1983-01-01), Guterman
patent: 4370798 (1983-02-01), Lien et al.
patent: 4389481 (1983-06-01), Poleshuk et al.
patent: 4467518 (1984-08-01), Bansal et al.
patent: 4476475 (1984-10-01), Naem et al.
patent: 4502202 (1985-03-01), Malhi
patent: 4505026 (1985-03-01), Bohr et al.
patent: 4545112 (1985-10-01), Holmberg et al.
patent: 4554572 (1985-11-01), Chatterjee
patent: 4554729 (1985-11-01), Tanimura et al.
patent: 4556895 (1985-12-01), Ohata
patent: 4560419 (1985-12-01), Bourassa et al.
patent: 4561907 (1985-12-01), Raicu
patent: 4581623 (1986-04-01), Wang
patent: 4593453 (1986-06-01), Tam et al.
patent: 4597160 (1986-07-01), Ipri
patent: 4603468 (1986-08-01), Lam
patent: 4619037 (1986-10-01), Taguchi et al.
patent: 4628589 (1986-12-01), Sundaresan
patent: 4633438 (1986-12-01), Kume et al.
patent: 4654121 (1987-03-01), Miller et al.
patent: 4772927 (1988-09-01), Saito et al.
patent: 4789644 (1988-12-01), Meda
patent: 4797804 (1989-01-01), Rockett, Jr.
patent: 4805147 (1989-02-01), Yamanaka et al.
patent: 4814850 (1989-03-01), Malhi
patent: 4841481 (1989-06-01), Ikeda et al.
patent: 4877483 (1989-10-01), Bergemont et al.
patent: 4890148 (1989-12-01), Ikeda et al.
patent: 4916665 (1990-04-01), Atsumi et al.
patent: 4918510 (1990-04-01), Pfiester
patent: 4920391 (1990-04-01), Uchida
patent: 4921813 (1990-05-01), Madan
patent: 4950620 (1990-08-01), Harrington, III
patent: 4966864 (1990-10-01), Pfiester
patent: 4980732 (1990-12-01), Okazawa
patent: 4987092 (1991-01-01), Kobayashi et al.
patent: 4990998 (1991-02-01), Koike et al.
patent: 5001539 (1991-03-01), Inoue et al.
patent: 5001540 (1991-03-01), Ishihara
patent: 5057898 (1991-10-01), Adan et al.
patent: 5083190 (1992-01-01), Pfiester
patent: 5135888 (1992-08-01), Chan et al.
patent: 5151376 (1992-09-01), Spinner, III
patent: 5157474 (1992-10-01), Ochii
patent: 5159416 (1992-10-01), Kudoh
patent: 5162892 (1992-11-01), Hayashi et al.
patent: 5173754 (1992-12-01), Manning
patent: 5187114 (1993-02-01), Chan et al.
patent: 5192704 (1993-03-01), McDavid et al.
patent: 5196233 (1993-03-01), Chan et al.
patent: 5248630 (1993-09-01), Serikawa et al.
patent: 5262655 (1993-11-01), Ashida
patent: 5283455 (1994-02-01), Inoue et al.
patent: 5298782 (1994-03-01), Sundaresan
patent: 5349206 (1994-09-01), Kimura
patent: 5373170 (1994-12-01), Pfiester et al.
patent: 5388067 (1995-02-01), Sato et al.
patent: 5451534 (1995-09-01), Yang
patent: 5591653 (1997-01-01), Sameshima et al.
patent: 5770892 (1998-06-01), Chan et al.
patent: 5801396 (1998-09-01), Chan et al.
patent: 5821136 (1998-10-01), Chan et al.
patent: 5866921 (1999-02-01), Kim
Iizuka, et al., "Variable resistance polysilicon for high density CMOS Ram," Semiconductor Device Engineering Laboratory, Toshiba Corporation, p. 370-373, Dec. 1984.
Garnache, "Complimentary FET memory cell," IBM Technical Disclosure Bulletin, vol. 18, No. 12, p. 3947 (1976), May 1976.
Lim, et al., Threshold voltage of thin-film silicon-on-insulator (SOI) MOSFETs, IEEE Transactions on Electron Devices, vol. ED-30, No. 10, p. 1244 (1983). Oct. 1983.
Yamanaka, et al., "A 25 um2, new poly-Si PMOS load (PPL) SRAM cell having excellent soft error immunity," IEDM, p. 48 (1988), Dec. 1988.
Weimer, "The TFT-a new thin-film transistor," Proceedings of the IRE, p. 1462 (1962), Jun. 1962.
Unagami, et al., "High-voltage polycrystalline-silicon TFT for addressing electroluminescent devices," Proceedings of the SID, vol. 25/2, p. 117 (1984), Dec. 1984.
Malhi, et al., "p-Channel MOSFETs in LPCVD polysilicon," IEEE Electron Device Letters, vol. EDL-4, No. 10, p. 369 (1983), Oct. 1983.
Shiehijo, et al., "Polysilicon transistors in VLSI MOS memories," IEDM, p. 228 (1984), Dec. 1984.
Sundaresan, et al., "A fully self-aligned stacked CMOS 64K SRAM," IEDM, p. 871 (1984), Dec. 1984.
Colinge, et al., "Stacked transistors CMOS (ST-MOS), an NMOS technology modified to CMOS," IEEE Transactions on Electron Devices, vol. ED-29, No. 4, p. 585 (1982), Apr. 1982.
Gibbons, et al., "One-gate wide CMOS inverter on laser-recrystallized polysilicon," IEEE Electron Device Letters, vol. EDL-1, No. 6, p. 117 (1980). Jun. 1980.
Seki, et al., "Laser-recrystallized polysilicon thin-film transistors with low leakage current and high switching ratio," IEEE Electron Device Letters, vol. EDL-8, No. 9, p. 425 (1987).
Wolf, Stanley "Silicon process for the VLSI Era vol. 2: Processing integration," Lattice Press, pp. 507-510, 1990.
Colinge, et al., "A high density CMOS inverter with stacked transistors," IEEE Electron Device Letters, vol. EDL-2, No. 10, p. 250 (1981), Oct. 1981.
Kamins, et al., "Hydrogenation of transistors fabricated in polycrystalline-silicon films," IEEE Electron Device Letters, vol. EDL-1, No. 8, p. 159 (1980), Aug. 1980.
Malhi, et al., "Characteristics and three-dimensional integration of MOSFETs in small grain LPCVD polycrystalline silicon," IEEE Journal of Solid-State Circuits, vol. SC-20, No. 1, p. 178 (1985).
Caymax, et al., "Low temperature selective growth of epitaxial Si and Si1-xGex layers from SiH4 and GeH4 in an ultrahigh vacuum, very low pressure chemical vapor deposition reactor: kinetics and possibilities," Thin Solid Films, p. 324 (1994), Dec., 1994.
Johnson, et al., "Selective chemical etching of polycrystalline SiGe alloys with respect to Si and Si02," Journal of Electronic Materials, vol. 21, No. 8 (1992), Dec., 1992.
Lin, et al.,"Effects of SiH4, GeH4, and B2H6 on the nucleation and deposition of polycrystalline Si1-xGex films," J. Electrochem. Soc., vol. 141, No. 9 (1994), Sep., 1994.
King, et al., "Deposition and properties of low-pressure chemical-vapor deposited polycrystalline silicon-germanium films," J. Electrochem. Soc., vol. 141, No. 9 (1994), Aug., 1994.
Prokes, Formation of epitaxial Si1-xGex films produced by wet oxidation of amorphous SiGe layers deposition on Si(100). Appl. Phys. Lett., vol. 53, p. 2483 (1988), Dec., 1988.
Tsutsu, "Oxidation of polycrystalline-SiGe alloys," Appl. Phys. Lett, vol. 64, No. 3, p. 297 (1994), Dec., 1994.
Lin, et al., "Fabrication of p-channel polycrystalline Si1-xGex thin film transistors by ultrahigh chemical vapor deposition," Appl. Phys. Lett. p. 1700 (1994), Sep., 1994.
Humlicek, et al., "Optical spectra of SixGe1-x alloys," J. Appl. Phys., vol. 65, p. 2827 (1989), Apr., 1989.
Selvakumar, "SiGe-channel n-MOSFET by germanium implantation," IEEE Electron Device Letters, vol. 12, No. 8 (1991), Aug., 1991.
King, et al., "PMOS transistors in LPCVD polycrystalline silicon-germanium films," IEEE Electron Device Letters, vol. 12, No. 11, p. 584 (1991), Nov., 1991.
Verdonckt-Vandebroek, et al., "High-mobility modulation-doped graded SiGe-channel p-MOSFETs," IEEE Electron Device Letters, vol. 12, No. 8 (1991), Aug., 1991.
Cao, et al., "Low pressure chemical vapor deposition of Si1-x-Gex films on Si02," J. Electrochem. Soc.,

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

SRAM cell structure with dielectric sidewall spacers and drain a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with SRAM cell structure with dielectric sidewall spacers and drain a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and SRAM cell structure with dielectric sidewall spacers and drain a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2055014

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.