Sputtering target fixture

Details Sputtering target fixture Sputtering target fixture

2004-10-07

2009-02-03

McDonald, Rodney G (Department: 1795)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298200, C204S298190

Reexamination Certificate

active

07485210

ABSTRACT:
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the magnetic field lines extending through the sputter target from the back surface to the exposed front surface of the sputter target; providing one or more pole extenders between magnetic poles of the source of the magnetic field lines and the exposed front surface of the sputter target.

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Magnetron Sputtering, Plasma Surface Engineering Corporation, TN 0001000 Feb. 2003, 4 pages.
J. R. German, A Simple Low Cost Method for Increased Performance of Planar Magnetron Sputtering Targets, pp. 1-5.

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