Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1992-06-26
1994-04-26
Weisstuch, Aaron
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419212, 20419224, 20429812, 20429813, 264 86, 4273722, 505731, 505816, C23C 1446, H01L 3924
Patent
active
053064054
ABSTRACT:
A method for preparing a slurry target for use in a sputtering apparatus. The target material is ground into a powder form, and mixed with a solvent to form a slurry. The slurry is poured into a target mold and allowed to slow dry by evaporation at or near room temperature. The target is mechanically stable, can be positioned in any orientation without falling out of the mold, and resists failure from thermal stresses during sputtering.
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Lorentz Robert D.
Sexton Joseph H.
Griswold Gary L.
Kirn Walter N.
Levinson Eric D.
Minnesota Mining and Manufacturing Company
Weisstuch Aaron
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