Sputtering target and method for manufacturing same

Details Sputtering target and method for manufacturing same Sputtering target and method for manufacturing same

1992-02-19

1995-07-25

Walsh, Donald P.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Making composite or hollow article

419 49, B22F 704

Patent

active

054359651

ABSTRACT:
A sputtering target is disclosed which includes a backing member of a cylindrical shape and a target material bonded onto an outer peripheral surface of the backing member by hot isostatic pressing. A method for manufacturing a sputtering target is also disclosed. First, a cylindrical backing member is inserted into a mold such that a space is defined between the backing member and the mold. A target material is then filled into the space between the backing member and the mold, and the mold is sealed. Thereafter, the target material and the backing member are subjected to hot isostatic pressing.

REFERENCES:
patent: 4941920 (1990-07-01), Envi et al.
patent: 5002728 (1991-03-01), Achikita et al.
Patent Abstracts of Japan, vol. 4, No. 101 (C-19) (583), Jul. 19, 1980, & JP-A-55-62164, May 10, 1980, Y. Itou, et al., "Sputtering Unit".
Patent Abstracts of Japan, vol. 14, No. 57 (C-684) (4000), Feb. 2, 1990, & JP-A-1-283367, Nov. 14, 1989, M. Mashima, et al., "Production of Targe for Sputtering".
Patent Abstracts of Japan, vol. 14, No. 211 (C-715) (4154), May 2, 1990, & JP-A-2-47261, Feb. 16, 1990, N. Hirao, "Silicide Target and Production Thereof".
Hirschhorn, Joel S., "Introduction to Powder Metallurgy", American Powder Met Institute, 1969, pp. 279-280.

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