Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1996-10-25
1998-09-29
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429808, 20429821, 20429822, C23C 1434
Patent
active
058141952
ABSTRACT:
A sputtering system using an AC power supply in the range of 10 kHz to 100 kHz uses two rotatable cylindrical magnetrons. The rotatable cylindrical magnetrons, when used for depositing a dielectric layer onto a substrate, clean off dielectric material that is deposited onto the target. This prevents a dielectric layer on the target from acting like a capacitor and may help avoid arcing. Additionally, an impedance-limiting capacitor can be placed in series in the electrical path between the targets through the transformer so as to reduce arcing. This impedance-limiting capacitor has a value much larger than the capacitors used to couple the power supply to a target in radio frequency sputtering systems.
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Byorum Henry
Hill Russell J.
Lehan John
Rough J. Kirkwood
Draegert David A.
Nguyen Nam
Pace Salvatore P.
The BOC Group Inc.
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