Sputtering system for deposition on parallel substrates

Details Sputtering system for deposition on parallel substrates Sputtering system for deposition on parallel substrates

1987-03-09

1989-05-09

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1434

Patent

active

048286680

ABSTRACT:
An improved sputtering system for depositing film on a substrate is disclosed. The system comprises a vacuum chamber, a pair of electrodes with a target inbetween, a cart on which a plurality of substrates are mounted and a transportation mechanism for transporting the cart passing through the deposition space between the electrodes. The substrates are mounted perpendicular to the electric field induced by the pair of electrodes.

REFERENCES:
patent: 3294670 (1966-12-01), Charschan et al.
patent: 3521765 (1970-07-01), Kaufman et al.
patent: 3840451 (1974-10-01), Golyanov et al.
patent: 4194962 (1980-03-01), Chambers et al.
patent: 4297189 (1981-10-01), Smith, Jr. et al.
patent: 4428816 (1984-01-01), Class et al.
patent: 4474659 (1984-10-01), Fazlin
patent: 4576700 (1986-03-01), Kadokura et al.
patent: 4601807 (1986-07-01), Lo et al.
patent: 4618477 (1986-10-01), Babu et al.
M. Nace et al., "High Rate . . . Targets", Journal of Crystal Growth, 45/1978, 361-364.

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