Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent
1998-12-21
2000-08-08
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
438700, 438702, 438706, 438710, 438714, 438720, 438722, 438584, 438641, 438648, 438650, 438652, 438656, 438715, H01L 21311
Patent
active
061002003
ABSTRACT:
The present invention is a method related to the deposition of a metallization layer in a trench in a semiconductor substrate. The focus of the invention is to sequentially perform heated deposition and etch unit processes to provide a good conformal film of metal on the inner surfaces of a via or trench. The deposition and etch steps can also be performed simultaneously.
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Moise Theodore S.
Russell Michael W.
Summerfelt Scott R.
Van Buskirk Peter C.
Vestyck Daniel J.
Advanced Technology & Materials Inc.
Perez-Ramos Vanessa
Utech Benjamin L.
Zitzmann Oliver A.
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